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  • Advanced Packaging Market Outlook to 2017 – ASE, SPIL, Amkor Technology, Chipmos Technologies, Chipbond Technology, and other Players

     



    (I-SoftwareNews.Com, February 27, 2018 ) In 2016, the world economy expanded by just 2.2 per cent, the slowest rate of growth since the Great Recession of 2009. Underpinning the sluggish global economy are the feeble pace of global investment, dwindling world trade growth, flagging productivity growth and high levels of debt. World gross product is forecast to expand by 2.7 per cent in 2017 and 2.9 per cent in 2018, with this modest recovery more an indication of economic stabilization than a signal of a robust and sustained revival of global demand. Given the close linkages between demand, investment, trade and productivity, the extended episode of weak global growth may prove self-perpetuating in the absence of concerted policy efforts to revive investment and foster a recovery in productivity. This would impede progress towards the Sustainable Development Goals (SDGs), particularly the goals of eradicating extreme poverty and creating decent work for all.

    FREE | Request Sample Copy is Available at: http://www.reportsweb.com/inquiry&RW00011536436/sample

    For the sake of making you deeply understand the Advanced Packaging industry and meeting you needs to the report contents, North America Advanced Packaging Industry Situation and Prospects Research report will stands on the report reader's perspective to provide you a deeply analysis report with the integrity of logic and the comprehensiveness of contents. We promise that we will provide to the report reader a professional and in-depth industry analysis no matter you are the industry insider,potential entrant or investor.

    Firstly, the report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure. The Advanced Packaging market analysis is provided for the international market including development history, competitive landscape analysis, and major regions' development status.

    Complete Report is Available at: http://www.reportsweb.com/north-america-advanced-packaging-industry-situation-and-prospects-research-report

    Split by Product Types, with production, revenue, price, and market share and growth rate of each type, can be divided into

    Active Technology

    Intelligent Technology

    Modified Atmosphere

    Split by applications, this report focuses on consumption, market share and growth rate of Advanced Packaging in each application, can be divided into

    Automotive Electronics

    Consumer Electronics

    Communication

    Other

    Secondly, development policies and plans are discussed as well as manufacturing processes and cost structures. This report also states import/export, supply and consumption figures as well as cost, price, revenue and gross margin by regions (Canada, U.S.A, and Others), and other regions can be added.

    Then, the report focuses on global major leading industry players with information such as company profiles, product picture and specification, capacity, production, price, cost, revenue and contact information. Upstream raw materials, equipment and downstream consumers analysis is also carried out. What's more, the Advanced Packaging industry development trends and marketing channels are analyzed.

    Inquire before Buying at: http://www.reportsweb.com/inquiry&RW00011536436/buying

    This report Advanced Packaging in North America market, especially in United States, Canada and Mexico focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering

    Market Research Key Players List:

    ASE

    SPIL

    Amkor Technology

    Stats Chippac

    Powertech Technology

    Jiangsu Changjiang Electronics Technology

    J-Devices

    UTAC

    Chipmos Technologies

    Chipbond Technology

    STS Semiconductor

    Tianshui Huatian Technology

    Nantong Fujitsu Microelectronics

    Carsem Semiconductor

    Walton Advanced Engineering

    Unisem

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